P475 – 1/2″ UHV sputter deposition HZB
Application
UHV sputter deposition system for thin film and multilayer deposition at 1/2″ substrates
Year of delivery
2020
Installation site
HZB, Berlin, Germany
Design Features
- UHV magnetron sputter deposition system in confocal sputter up configurations.
- Up to five 2″ magnetrons in confocal configuration.
- All magnetrons with manual in situ source tilting.
- All magnetrons with easy changeable magnetic system for use with ferromagentic or non-ferromagnetic target materials.
- Low pressure and low power sputtering possible.
- Partly motorized 4 axes sample manipulator with integrated pneumatic sample shutter, sample cooling and sample heating.
- Motorized x-y translation.
- Manual z translation and stage tilting (phi rotation).
- Minimum sample temperature below -100°C.
- Maximum sample temperature above 700°C.
- Ion source option for sample precleaning and mild etching.
- Thickness sensor setup with manual translation stage for sputter rate check before deposition.
- Integrated bake out system.
Special Features
- Two magnetrons can be additionally used in face to face configuration or in glace angle deposition configuration by sample stage tilting.
- System is prepared to be part of a cluster tool, beam line systm or other type of vacuum system.
- Later adding a load lock chamber possible.
Outer Dimensions
Technical specifications and performance values
General
Sputtering chamber
Size
400 mm diameter, about 600 mm height
Material
stainless steel
Vacuum
Sputtering chamber
Base pressure
< 7 * 10-9 mbar
Pump down time
< 5 hours to < 10-7 mbar
Chamber pumping
Turbo pumping stage, chamber lid differentially pumped by dry foreline pump
Bake out
< 150°C
Manipulator features
Sputtering chamber
Sample size
diameter max. 1/2″ substrate
Motion axes
4 axes (motorized x-y translation stage, manual z tranlsation and manual sample stage tilting)
Temperatures
< -100°C (not stabilized) up to 900°C at sample (short time heating) / > 700°C at sample (long time heating)
Special features
Software controlled wobble motion in x-y plane.
Performance test results
Chamber pump down
Long time sample heating
Motorized sample wobbling
Sputter source stability
