P456 – 4″ HV sputter deposition HZDR
Application
HV sputter deposition system for thin film and multilayer deposition at 4″ substrates
Year of delivery
2017
Installation site
HZDR, Dresden-Rossendorf, Germany
Design Features
- HV magnetron sputter deposition system in face to face sputter down configuration.
- Up to six 4″ magnetrons in face to face configuration with possibility of low pressure and low power sputtering.
- Motorized sample manipulator with maximal sample temperature well above 900°C.
- Integrated bake out system.
- Load lock chamber with storage.
Special Features
- System is prepared to be added to a cluster tool via second transfer port at sputtering chamber.
- To the load lock chamber a second process chamber can be added.
- Different sample sizes from 4″ wafer down to 10mm x 10mm samples can be handled (using different kind of sample adapters).
Outer Dimensions
Technical specifications and performance values
Size
800 mm diameter, about 500 mm height
Material
stainless steel
Size
200 mm diameter, about 500 mm height
Material
stainless steel
Base pressure
< 5 *10-8 mbar
Pump down time
6 minutes to < 10-5 mbar
Chamber pumping
Turbo pumping stage, chamber lid differentially pumped by dry foreline pump
Bake out
< 120°C
Base pressure
< 7 * 10-8 mbar
Pump down time
4 minutes to < 10-5 mbar
Chamber pumping
Turbo pumping stage with dry foreline pump
Sample size
diameter max. 4″ substrate
Motion axes
motorized manipulator arm rotation (continous rotation and positioning)
Temperatures
Room temperature (not stabilized) up to 1000°C at sample (short time heating) / > 850°C at sample (long time heating)
Storage size
10 sample holders
Sample size
diameter max. 4″ substrate
Motion axes
2 manual axes (rotation, z tranlsation)
Rotation axis equipped with an air side idexer plate for easy and fast sample loading via access door or transfer rod